HT-490 Automatic Mobile Phone BGA Rework Soldering Station Thermoregulator Desoldering Hot Air HT 490
Features:
1. With high precision temperature control instrument imported raw materials (PLC). J heater precise control of BGA desoldering process.
2. The machine USES three temperature area independent control, temperature control more accurate.
The first temperature area. The second temperature area all can set 8 paragraph litre (drop) temperature + 8 section temperature control, can also store 10 team temperature curve.
The third temperature area USES far infrared heating board preheat, independent temperature control, ensure the welding process of PCB can comprehensively preheating,
3. The machine has the computer communication function, the built-in PC serial port, external temperature measuring interface, equipped with software, computer control can be realized.
4. Imported high-precision thermocouples, realize the temperature of precision detection.
5. Using upper heating and bottom heating temperature curve way walk alone, cross-flow rapid cooling fan, guarantee the principle in PCB welding process, won’t be out of shape.
6. Desoldering and welding finished with alarm functions, equipped with vacuum pen, convenient desoldering suction trip after BGA.
7. PCB positioning of the card slot, v-shaped fissure of flexible and convenient portable universal fixtures, to protect PCB.
8. For big heat capacity PCB and other high requirements, lead-free solder can easily handle.
9. Sirocco can rotate 360 degrees arbitrary time-and-labor-saving, easily replaced. Equipped with a variety of sizes sirocco can be customized tip special requirements.
10. Suitable for laptop computer motherboard, desktop computer motherboard, etc. Large circuit board maintenance, and mobile phone motherboard such small small-sized chip maintenance.
Item |
HT-490 BGA Rework Station |
Voltage |
AC220V±10%, 50/60Hz |
Current |
50 |
Rated Capacity |
3800W |
Rated Duty Cycle |
100 |
Dimensions |
|
Weight |
48kg |
Usage |
BGA chip-level repairing, IC soldering reballing |
Temperature zone |
3 zones top, bottom and preheating |
Top heater |
Hot air 800W |
Bottom heater |
2nd heater 800W, 3rd IR heater 2200W |
Positioning |
V-groove, with external universal fixture |
Temp accuracy |
±2℃ |
Temperature control Settings |
8 levels of variable (up/down) and constant temperature controls |
Temperature curves |
N groups storage |
PCB size |
Min. 10mm*10mm Max. 350mm*400mm |
Infrared Preheating area |
210mm*340mm |
Warranty |
12 months |
1 x HT-490 BGA Rework Station
5 x Nozzles (25*25mm, 29*29mm, 34*34mm, 40*40mm, 50*50mm)
1 x Aluminium plate for BGA IC reballing
1 x Software CD
1 x Data line
1 x Manual
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